The solder mask on a printed circuit board (PCB) plays a crucial role in protecting copper traces and preventing shorts. Modifying the solder mask to expose via holes can be complex due to its negative layer nature in Gerber files. Directly patching the solder mask over vias can lead to overlapping features and rendering issues, potentially causing problems after PCB fabrication.
A simpler and more robust approach involves strategically removing solder mask only in high-heat areas and avoiding placing vias within those zones. This method offers comparable effectiveness without the complexities of patching. While this simplifies design, it’s important to consider protecting the bottom of the PCB from potential damage.
Protecting the underside of the PCB is vital, especially when working in environments with conductive materials. A practical solution involves using corrugated cardboard as a protective layer. The PCB is pressed into the cardboard to create an imprint, and any indentations caused by protruding through-hole components are deepened. The PCB is then secured to the cardboard using glue, tape, or screws, and the excess cardboard is trimmed.
Alternatively, PCB standoffs screwed into mounting holes offer a more standardized protection method. This elevates the board, preventing contact with the work surface and potential conductive debris. Both methods effectively safeguard the PCB bottom, preventing shorts and damage.
